Electronic packaging device and method

ABSTRACT

A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a plurality of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component are routed through the lead channels. A plurality of lead terminals, adapted to cooperate with the specially shaped lead channels, are received within the lead channels, thereby forming an electrical connection between the lead terminals and the wire leads of the electronic component(s). The special shaping of the lead channels and lead terminals restricts the movement of the lead terminals within the lead channels in multiple directions during package fabrication, thereby allowing for the manufacture of larger, more reliable devices. In another aspect of the invention, the device includes a series of specially shaped through-holes provided within the base member to allow the routing of wire leads there through. The bottom surface of the base member is chamfered to facilitate “wicking” of molten solder up the wire leads during soldering, thereby allowing for a stronger and more reliable joint. A method of fabricating the device is also disclosed.

RELATED APPLICATIONS

[0001] This application is a continuation of U.S. patent applicationSer. No. 09/313,820 entitled “ELECTRONIC PACKAGING DEVICE AND METHOD”,filed on May 18, 1999, now U.S. Pat. No. ______.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates generally to non-semiconductorelectrical and electronic elements used in printed circuit boardapplications and particularly to an improved package and method ofpackaging microminiature electronic components.

[0004] 2. Description of Related Technology

[0005] Dual in-line chip carrier packages (DIPs) are well known in thefield of electronics. A common example of a DIP is an integratedcircuit, which is typically bonded to a ceramic carrier and electricallyconnected to a lead frame providing opposed rows of parallel electricalleads. The integrated circuit and ceramic carrier are normally encasedin a black, rectangular plastic housing from which the leads extend.

[0006] The continuing miniaturization of electrical and electronicelements and high density mounting thereof have created increasingchallenges relating to electrical isolation and mechanicalinterconnection. In particular, substantial difficulty exists inestablishing reliable and efficient connections between fine gauge (AWG24 to AWG 50) copper wire leads associated with various electronicelements within a given DIP. One particularly useful prior art method ofconnecting element leads to the lead frame terminals (or interconnectingthe leads of two or more electronic elements) is disclosed in U.S. Pat.No. 5,015,981, which is illustrated herein in FIG. 1. Commonly known as“interlock base” technology, this method involves routing the wirelead(s) 2 to an unused lead frame slot or channel 3 located at the edgeof the non-conducting base member 10, as shown in FIGS. 1 and 2. Each ofthese channels is designed to receive a single conductive lead frameterminal 4, which when assembled asserts an inward bias on the packagethereby forcing contact between the conductive terminals 4 of the leadframe and the electronic element lead(s) 2; see FIG. 2. This method hasalso typically utilized a locking mechanism, such as a small tab 12 orextension on the four corner lead terminals 14, 15, 16, 17, which locksinto a plastic protrusion 18 of similar dimensions using the springtension associated with the individual lead terminals 4 of the leadframe 34. Refer again to FIG. 2.

[0007] However, while simple, this locking mechanism design suffers fromthree primary disabilities: (i) the relatively low amount of normalforce that the package can sustain during manufacture without dislodgingor deforming the locking tabs; (ii) the localization of the resistive orreaction force provided by the locking tabs on the four comers of thepackage; and (iii) the ability of the tabs to provide resistive force inonly one direction. These limitations ultimately translate torestrictions relating to the size of the package that can be reliablyassembled. For example, the use of a prior art lead frame 34 and basemember 10 as described above works well for 16 pin packages, whichtypically have a surface area (measured across the top of the package)on the order of 0.1 square inches. When larger packages with moresurface area and leads are manufactured, however, the lead frame oftendislocates and separates from the base member, thereby allowing formovement and/or loss of contact of the lead frame terminals with thecomponent leads. This reduces the reliability of the final package as awhole, and increases the cost of manufacturing, since more defective ornon-conforming devices are manufactured in a given production run. Thisdislocation and separation is largely a result of the increased downwardforce associated with transfer molding the larger package. Additionally,as previously noted, the distribution of force in the larger packagewith respect to the leads is less desirable, since the spacing betweenthe four locking tabs on the comers of the package is increased, therebyallowing greater flexing and distortion of the leads interposed therebetween. The ability of the lead frame terminals 4 to move in onedirection also contributed to device failure in that the potential formisalignment and separation of the lead frame and base.

[0008] One “work-around” solution for these problems has comprised theuse of an adhesive or epoxy placed between the lead frame terminals 4and the base member 10 so to maintain a rigid contact between the two.However, this solution obviates many of the benefits of the interlockbase technology by introducing additional process steps, materials, andcuring times.

[0009] In a somewhat unrelated aspect, the aforementioned interlock basetechnology suffered from another disability; namely, a significantpotential for shearing off of the soldered leads after formation.Specifically, one prior design of the interlock base used a series of“through-holes” 13 designed to accommodate multiple wire leads 2 andfacilitate their bonding via a soldering process, as shown in FIGS. 3aand 3 b. See also Applicant's pending U.S. patent application Ser. No.08/791,247, entitled “Through-Hole Interconnect Device With IsolatedWire Leads and Component Barriers” filed Jan. 30, 1997, which isincorporated herein by reference in its entirety. Basically, the wireleads to be joined were twisted and routed through the through-hole soas to protrude from the bottom of the package as shown in FIG. 3aherein. Through-holes having an essentially flat or unchamfered bottomsurface were used. During soldering, there was a tendency for the moltensolder 19 to form a bubble 20 around the egress point of the leads fromthe feed-through hole at the bottom surface. This bubble effectivelydisplaced solder from the leads as shown in FIG. 3b, thereby making theformation of the solder joint occur at a position lower on the leadsthan would occur if the bubble were not present. When the extensiveportion of leads was subsequently trimmed, the entire solder joint wouldsometimes be inadvertently trimmed off as well, thereby potentiallyresulting in failure of the joint.

[0010] Based on the foregoing, it would be highly desirable to providean improved apparatus and method for connecting a lead frame to apackage of any size such that the physical forces associated withmolding of the package and soldering of the leads would not result inmovement or separation of the lead frame from the interlock base or wireleads disposed within the lead channels. Additionally, such an improvedapparatus and method would allow for more complete soldering of anyelectrical joints located within feed-through holes within the interlockbase, thereby reducing or eliminating failure of these joints due toinadvertent removal during processing.

SUMMARY OF THE INVENTION

[0011] The present invention satisfies the aforementioned needs byproviding an improved microelectronic component package and interconnectdevice having a plurality of specially shaped lead channels which allowlead terminals to be more rigidly captured therein.

[0012] In a first aspect of the invention, an improved microelectronicdevice base member is disclosed which is fabricated from non-conductivematerial and includes at least one electronic component recess and aplurality of specially shaped lead channels. These lead channels areadapted to receive specially shaped lead terminals associated with alead frame such that the lead frame and terminals are restricted fromany significant movement within the lead channels during devicefabrication. In one embodiment, the shapes of the lead channels and leadterminals is such so as to prevent longitudinal movement of the leadterminals within the channels in either direction, yet facilitate easyassembly. Such an arrangement allows the device to be easily assembledwithout additional labor or process steps, and also allows thefabrication of larger packages with a high degree of reliability. Thedisclosed base member also optionally includes a plurality of chamferedthrough-holes which permit more secure joining of the wire leads of theelectronic component(s) when installed within the base member.

[0013] In a second aspect of the invention, an improved microelectronicdevice is disclosed utilizing the aforementioned base member and leadterminals. The device includes at least one electronic component havingwire leads which is disposed within the base member, and a plurality ofshaped lead terminals received within the shaped lead channels of thebase member. The shape of the lead terminals and corresponding channelsis such to restrict the movement of the lead terminals (and associatedlead frame) within the channels during device fabrication, therebyallowing for constant and firm contact between the component wire leadsdisposed within the lead channels and the lead terminals. This designaccordingly allows the reliable manufacturing or larger devices with aminimum of process steps. The device is also encapsulated in a polymerovermolding.

[0014] In a third aspect of the invention, an improved method forfabricating the aforementioned device is disclosed. In one embodiment ofthe method, the aforementioned base member is formed from anon-conductive material using a molding process. The electroniccomponent(s) and lead frame are also formed. The electronic component isinserted in the recess of the base member, and its wire leads routedthrough one or more of the lead channels in the base member.Additionally, any wire leads desired to be joined with those of othercomponents are twisted and inserted in the through-holes such that theyprotrude from the bottom of the base member. Next, the lead frame ismounted on the base member such that the shaped lead terminals arereceived and locked within the corresponding shaped lead channels,thereby forming a rugged electrical contact between the lead terminalsand any wire leads routed in the channels. The base member, wire leads,and lead terminals are then dip-soldered to form permanent electricaljoints. The wire leads are trimmed, and the device encapsulated in apolymer overmolding using a transfer molding process. The extensiveportions of the lead terminals are then trimmed from the lead frame andformed to the desired shape.

[0015] These and other objects and features of the present inventionwill become more fully apparent from the following description andappended claims taken in conjunction with the following drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0016]FIG. 1 is a perspective view of a prior art microelectronicpackaging device illustrating the relationship between the leadterminals and lead channels.

[0017]FIG. 2 is perspective view of the prior art device of FIG. 1,illustrating the electrical interconnection between the component leadand lead terminals within a single lead channel, and the lockingmechanism associated therewith.

[0018]FIGS. 3a and 3 b are side cross-sectional views of the prior artdevice of FIG. 1, illustrating the prior art wire lead through-holeconfiguration before and after soldering, respectively.

[0019]FIG. 4 is a perspective view of a first embodiment of the basemember and associated lead terminals of the present invention

[0020]FIG. 4a is detail plan view of the lead channels and leadterminals of FIG. 4.

[0021]FIG. 4b is a detail perspective view of one of the second leadchannels of the base member of FIG. 4, illustrating the “T-bar”arrangement.

[0022]FIG. 5 is a plan view of a second embodiment of the lead channelsand associated lead terminals according to the present invention.

[0023]FIG. 6 is a plan view of a third embodiment of the lead channelsand associated lead terminals according to the present invention.

[0024]FIG. 7 is a cross-sectional view of the first embodiment of FIG.4, taken along line 7-7, illustrating the through-hole arrangement ofthe present invention.

[0025]FIG. 8 is a perspective view of the electronic packaging device ofthe present invention prior to encapsulation, illustrating the placementof the various components with respect to the base member of FIG. 4.

[0026]FIG. 9 is a perspective view of the electronic packaging device ofthe present invention, after encapsulation.

[0027]FIG. 10 is a flow chart illustrating one embodiment of the methodof manufacturing the electronic packaging device according to thepresent invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0028] Reference is now made to the drawings wherein like numerals referto like parts throughout.

[0029]FIGS. 4 and 4a illustrate a first embodiment of the base member100 and associated lead terminals 102 according to the presentinvention. As illustrated in FIG. 4, the base member 100 is comprisedgenerally of a three-dimensional base body 104 having one or moreelectronic component recesses 106 formed at least partly therein. Thebody 104 includes a top surface 110, side surfaces 112 a-112 d, and abottom surface 114. The body 104 also includes a plurality of first leadchannels 116 and a plurality of second lead channels 118 formed withinthe body 104, described in greater detail below. The base body 104 isideally fabricated from a non-conductive material such as a liquidcrystal polymer using an injection molding process, although othermaterials and processes may be used. One or more wire lead through-holes105 are also optionally formed in the base body 104, as described belowwith reference to FIG. 7. In the present embodiment, the lead channels116, 118 are disposed on the opposing, elongate side surfaces 112 a, 112c of the base body, and oriented in a vertical direction such that thechannels 116, 118 run generally from the top surface 110 to the bottomsurface 114, and are parallel to one another. This orientationfacilitates the routing of wire leads associated with the electroniccomponents disposed in the recesses 106 into the lead channels 116, 118when the packaging device is assembled; see FIG. 8. The individualrecesses 106 are shaped to receive any one of a variety of differentelectronic elements, such as toroidal induction coils also as shown inFIG. 8. While the discussion presented herein is specific to theillustrated toroidal induction coils, it can be appreciated that avariety of different electronic components may be used in conjunctionwith the invention with equal success.

[0030] As shown in FIG. 4, a plurality of first and second leadterminals 120, 122 are received within the lead channels 116, 118 whenthe packaging device is assembled. These lead terminals 120, 122 arepart of a larger lead frame 130 before being separated therefrom duringmanufacturing. The use of a lead frame allows all of the lead terminalsto be places within their respective lead channels in one processingstep, as is described further below. The lead frame 130 (and attachedlead terminals 120, 122) of the present embodiment are fabricated froman electrically conductive metal alloy, although other materials mayconceivably be used.

[0031] Referring again to FIG. 4a, the structure and operation of thefirst and second lead channels 116, 118 and their associated leadterminals 120, 122 are described. The first lead channels 116 are formedso as to include a first retention element 134. In the presentembodiment, the retention elements 134 comprise a shape 136 formed ineach or a subset of the first lead channels 116. The shape 136 comprisesa narrow portion 140 at the top end 142 of the channel 116, and a widerportion 144 adjacent to and below the narrow portion 140, hereinafterreferred to as a “bayonet” shape. A complementary shape 150 in thecorresponding first lead terminal 120, having a narrow portion 152 atopa wider portion 154, is formed to permit the lead terminal 120 to engagethe lead channel 116 to prevent the lead terminal 120 from moving in afirst longitudinal direction 156 beyond a desired point within the leadchannel 116 when the terminal 120 and base member 100 are joined.

[0032] Similarly, as shown in FIGS. 4a and 4 b, the second lead channels118 include a retention element 160 in the form of a shape 162, thelatter designed to engage the second lead terminals 122 when receivedwithin the channels 118. The shape 162 employed in the second leadchannels 118, however, is different than that used in the first leadchannels 116, so as to allow the lead terminals 120, 122 to be insertedinto their respective lead channels 116, 118 from the same direction,yet prevent the movement of the second lead terminals 122 in a secondlongitudinal direction 164 once inserted. Specifically, the second leadchannels 118 use a modified “bayonet” shape having a ramp portion 165proximate to the top portion 167 of the channel 118, as shown in FIG.4b. This ramp portion 165 receives and urges a “T-bar” shape 169 formedon the distal end 170 of all or a subset of the second lead terminals122 in a direction away from the base body 104 when the terminals 122are inserted into the second channels 118. When fully inserted, theT-bar shape 169 of each terminal 122 engages a shoulder region 174 onthe top surface of the base body 104, so as to prevent the withdrawal ofthe second lead terminals from the second lead channels 118. Since thefirst and second lead terminals 120, 122 are rigidly connected via thelead frame 130 (prior to severance) as previously described, theinteraction of the first lead channels 116 and their corresponding leadterminals 120, and the second lead channels 118 and their correspondingterminals 122, prevent the lead frame from moving substantially ineither the first or second longitudinal directions 156, 164 when theterminals 120, 122 are mated to the base member 100. In this manner, thelead terminals (and lead frame) are “locked” to the base member 100 viaboth the first and second lead channels. Furthermore, the lead terminals120, 122 are precluded from moving laterally within the lead channels116, 118 by the close tolerance fit between the terminals and the sidewalls of the channels.

[0033] It is noted that since the lead frame 130 and lead terminals 120,122 of the present embodiment are constructed of a metallic alloy havingsome degree of resiliency, the outward deflection of the T-bar shape 169of the second lead terminals 122 produces an inward bias force resistingsuch deflection. In this fashion, as the lead frame 130 is being mountedon the base member 100, and the terminals 120, 122 inserted into theirrespective lead channels 116, 118, a resistive force opposing themovement of the lead terminals 120, 122 longitudinally within thechannels is created until the leads (and lead frame) are in their“locked” position, at which point the T-bar shapes 169 are receivedwithin the shoulder region 174 of the base body 104. Hence, the leadframe and terminals are designed to “snap” onto the base member in africtional manner.

[0034] Note also that the width of the base body (or alternatively, thedepth of the lead channels) may also be varied as a function of verticalposition on the base body so as to provide a variable interference fitwith the lead terminals. Such a variable fit may be useful, for example,during assembly, so as to permit an assembler to more easily place andalign the ends of the lead terminals 120, 122 within the lead channels116, 118 before sliding the lead frame 130 fully into position.

[0035] It is further noted that while the embodiment of FIGS. 4-4 butilizes nine first lead channels 116 which are interleaved orinterspersed with three second lead channels 118 on each of the elongatesides of the body 104 in a predetermined pattern, other patterns andcombinations of lead channels and associated terminals may be used. Forexample, first and second lead channels/terminals could be dispersed inon alternating basis (i.e., one first channel, one second channel, onefirst channel, etc.). Alternatively, the orientation of each of the leadchannels could be inverted (i.e., rotated 180 degrees) with respect tothe base body 104 such that the lead frame 130 and terminals 120, 122are inserted onto the top of the body 104 rather than the bottom. Manysuch variations are possible, and all being considered within the scopeof the invention.

[0036] Referring now to FIG. 5, a second embodiment of the presentinvention is disclosed. In this second embodiment, a series ofrectangular retention elements 200 are formed within all or a subset ofthe lead channels 202 of the base member 206. These retention elements200 are arranged at a given vertical elevations along the sides of thebase member for simplicity of manufacturing, although other arrangementsmay be used. As in the embodiment of FIG. 4, a ramp portion 208 isincluded within each of the lead channels 202 to facilitate guiding andbiasing the lead terminals 210 during mounting of the lead frame 212.When the lead frame 212 is properly positioned on the base member 206,the shapes 214 formed in the lead terminals 210 engage the retentionelements 200 in the lead channels 202 so as to restrict movement of thelead terminals within the lead channels in both longitudinal directions220, 222. As with the embodiment of FIG. 4, the lead frame 212 and basemember 206 “snap” together when the lead frame 212 is properlypositioned due to the biasing force on the lead terminals 202 and thephysical relationship between the components.

[0037]FIG. 6 illustrates a third embodiment of the base member and leadterminals of the present invention. In this third embodiment, a seriesof “notch” recesses 300 are formed within all or a subset of the leadchannels 302 of the base member 304. The lead terminals 306 include acorresponding shape 308 formed therein which cooperates with the recess300 within the respective lead channel 302 to retain the lead terminals306 in a fixed position when the lead frame 310 is mounted on the basemember 304. The fit between the lead channel recess 300 and the shape308 of the lead terminals is such that the lead terminals again “snap”into their recesses at a desired position, aided by a plurality of rampportions 311 disposed within the lead channels 302. Longitudinalmovement of the lead terminals 306 is restricted by the cooperation ofthe shapes 308 and the recesses 300.

[0038]FIG. 7 is a cross-sectional view of the first embodiment of FIG.4, illustrating the through-hole arrangement of the present invention.The base body 104 includes at least one through-hole 105 disposed withinthe body 104 so as to facilitate the routing and bonding of the wireleads 402 associated with the electronic component(s) 404 containedwithin the base member 100. The individual wire leads 402 of thecomponents 404 are joined, such as by twisting them together, anddisposing them within the through-hole(s) 105 such that the distalportion 405 of the joined leads extends below the bottom surface 114 ofthe base body 104. This arrangement facilitates mass soldering ofseveral such joined leads, such as by dip soldering or wave soldering.The through-holes 105 are further provided with a chamfered region 406disposed adjacent to the bottom surface 114 as shown in FIG. 7. Thischamfered region 406 helps preclude the formation of solder bubbles inthe area of the through-hole (or alternatively, if a bubble does form,allows the bubble to rise above the plane of the bottom surface 114),thereby allowing solder 407 to “wick” up the joined leads 402 furtherand above the plane of the bottom surface as well. This approachdramatically reduces the occurrence of inadvertent trimming of thesolder joint during subsequent process steps, since the solder joint nowextends well into the through-hole 105.

[0039] It will be readily appreciated that the number, size, location,and orientation of the through-holes 105 of the present invention may bevaried as desired. Furthermore, such through-holes may be used with anyof other embodiments of the invention, such as those described withreference to FIGS. 5 and 6 above.

[0040] Referring now to FIG. 8, the electronic packaging device of thepresent invention is now described. As shown in FIG. 8, the device 500comprises the base member 100 previously discussed with respect to FIGS.4-4 b, lead terminals 120, 122 mounted on a lead frame 130, as well asone or more electronic components 404 having wire leads 402. Note thatthe device shown in FIG. 8 is in a state of partial completion, prior toencapsulation, and is inverted from that shown in FIG. 4, to betterillustrate the relationship between the electronic components 404, wireleads 402, lead channels 116, 118, and lead terminals 120, 122. It willbe recognized that while the base member 100 and leads 120, 122 of FIGS.4-4 b are utilized in the device 500 of FIG. 8, other base member andlead terminal combinations may be used with equal success. Theembodiment of FIG. 8 is therefore merely illustrative.

[0041] The electronic component 404 of the present embodiment comprisean induction coil having a doughnut shaped iron core member 522 aroundwhich are wrapped coils of thin gauge wire, with the ends of the wireextending outward and forming terminal ends or leads 402. The components404 of the present embodiment are disposed within their respectiverecesses 106 of the base body 104 in such a manner that the central axisof each coil element is aligned with that of all other coil elements asshown in FIG. 8, although it will be appreciated that other orientationsand configurations may be used. This arrangement is desirable in that aminimum of space is required to accommodate a given number ofcomponents, and field interactions between each component 404 and itsneighboring component(s) are generally spatially uniform and consistentfrom component to component. This assists in distributing any potential(voltage) generated by alternating magnetic or electric fields presentduring operation more evenly along the windings of each element, therebyincreasing overall device longevity and permitting “tuning” of theelectrical response of the package as a whole. Note that silicone oradhesive may optionally be used within the recesses 106 to maintain thecomponents 404 in the desired position during assembly of the device500.

[0042] Through-holes 105 of the type described with reference to FIG. 7herein are also provided in each of the component barriers 526. Thesethrough-holes allow the interconnection of leads from the variouselectronic components 404 installed in the recesses, thereby providinggreat flexibility in the routing and interconnection of leads duringboth the design and assembly phases.

[0043] In addition to being joined in the through-holes 105, some of thewire leads 402 of the components 404 are routed into the lead channels116, 118 of the base member 100 prior to installation of the leadterminals 120, 122 so as to form an electrical contact with the leadterminals 120, 122 when the device 500 is assembled. Both the wirelead/electrical terminal contacts 530, and the joined wire leads 402disposed within the through-holes, are soldered in order to form a morepermanent electrical joint. Ultimately, the device 500 is encapsulatedin a polymer encapsulant 550 of the type well known in the electronicarts, and the lead terminals 120, 122 trimmed from the leadframe anddeformed to the desired profile as illustrated in FIG. 9.

[0044] The method of assembling the electronic packaging device of thepresent invention is now described with reference to FIG. 10. In thefirst process steps 602, 604, 606 of the method 600, the base member100, lead frame 130, and electronic component(s) 404 are formed usingprocesses well understood in the art. For example, the base member 100may be formed using an injection molding process, and the lead frameformed from a metal alloy using a stamping and bending process. Manydifferent methods of forming these components are known and may be usedwith equal success.

[0045] Next, the electronic components 404 are placed within therecesses formed within the base member 100 in step 608. A silicone gelor other adhesive may optionally be used to aid in retaining thecomponents 404 in their recesses during subsequent processing. The wireleads 402 of the electronic components are then routed into the leadchannels 116, 118 in the next step 610. If the base member 100 includesthrough-holes 105 such as those previously described, certain of thewire leads of the components 404 are then mechanically joined together(typically, using a twisting or comparable process) in step 612, andthen routed into the through-holes in step 614 such that the distalportion 405 of the leads 402 extends below the bottom surface of thebase member 100 as shown in FIG. 7. In the next step 616, the formedlead frame 130 is placed on the base member 100 in the properorientation, and the lead terminals 120, 122 “locked” into theirrespective lead channels 116, 118 in the following step 618 aspreviously described. The partially assembled device is then soldered,such as by a dip soldering process, in step 620. When the aforementionedsolder process is completed, the flux is then cleaned with an isopropylalcohol using an ultrasonic cleaner or comparable means per step 622.The wire leads (both those routed through the lead channels 116, 118,and those routed into the through-holes 105) are then trimmed asnecessary in step 624. In the next step 626, the device is encapsulatedin a suitable plastic or polymer material, which material forms a smoothrectangular package as illustrated in FIG. 9. The device is preferablyencapsulated in an IC grade thermoset epoxy 550, such as that availablefrom Dexter under the Trademark HYSOL MG25F-05, or equivalent thereof.Thereafter, in steps 628 and 630 respectively, the lead frame is trimmedand formed in a die press or the like to finish the lead terminals 120,122 in a suitable form, for either surface mounting or pin mounting asdesired.

[0046] It will be recognized that while the aforementioned method 600 isdescribed in terms of a specific sequence of steps, the order of certainof these steps may be permuted if desired. For example, while the method600 of FIG. 10 routes the lead wires into the lead channels per a firststep 610 prior to joining and routing the lead wires per subsequentsteps 612, 614, the order of these two operations may be reversed.Similarly, the formation of the base member, lead frame, and electroniccomponents may occur in series, rather than parallel as shown in FIG.10. Additionally, it is noted that other process steps may be added,such as for inspection and/or testing of certain components, and othersteps optionally deleted (such as those relating to joining and routingthe joined the wire leads if no through-holes are employed within thedevice). Many such permutations and combinations are possible, all beingconsidered within the scope of the present invention.

[0047] While the above detailed description has shown, described, andpointed out the fundamental novel features of the invention as appliedto various embodiments, it will be understood that various omissions,substitutions, and changes in the form and details of the device orprocess illustrated may be made by those skilled in the art withoutdeparting from the spirit or essential characteristics of the invention.The described embodiments are to be considered in all respects only asillustrative and not restrictive. The scope of the invention is,therefore, indicated by the appended claims rather than by the foregoingdescription. All changes which come within the meaning and range ofequivalence of the claims are to be embraced within their scope.

What is claimed is:
 1. An electronic device, comprising; anon-conducting three-dimensional electronic element base body having;top, side, and bottom surfaces; at least one recess disposed at leastpartly within said base body; a plurality of lead channels extendingfrom said top surface onto at least one of said side surfaces of saidbase body, said plurality of lead channels having a first shape formedtherein; at least one electronic element disposed in said at least onecavity, said electronic element having a plurality of wire leads; and aplurality of lead terminals having a second shape received withinrespective ones of said plurality of lead channels, said second shapebeing adapted to engage at least a portion of said first shape, at leastone of said lead terminals forming a conductive contact with at leastone of said plurality of wire leads; wherein the longitudinal movementof said lead terminals within said lead channels is restricted by thecooperation between said first and second shapes of said lead channelsand said lead terminals, respectively.
 2. The electronic device of claim1, wherein said first shapes comprise substantially rectangular cavitiesdisposed within said lead channels.
 3. The electronic device of claim 1,further comprising at least one through-hole being disposed in said basebody, said at least one through-hole being adapted to receive at leastone of said plurality of wire leads.
 4. The electronic device of claim2, further comprising at least one through-hole forms a passage betweensaid top surface and said bottom surface of said base body, said basebody being chamfered on said bottom surface proximate to said at leastone through-hole.
 5. An electronic device base member, comprising: anon-conducting base body having bottom, top, and side surfaces; a recessdisposed at least partly within said body; said recess being adapted toreceive an electrical component; a plurality of first lead channelsdisposed substantially on at least one of said side surfaces, at leastone of said first lead channels being adapted to receive a first leadterminal; and at least one first retention element, at least a portionof said at least one first retention element being disposed within saidat least one first lead channel, said at least one first retentionelement preventing said first lead terminal from moving substantially ina first longitudinal direction within said at least one first leadchannel when said first lead terminal is received therein.
 6. The basemember of claim 5, wherein said at least one first retention elementcomprises said at least one first lead channel having at least onevariation in width along its length.
 7. The base member of claim 6,wherein said at least one variation in width of said at least one firstlead channel comprises a first region and a second region, said firstregion having a width narrower than that of said second region.
 8. Thebase member of claim 7, further comprising: a plurality of second leadchannels, said second lead channels being disposed substantially on atleast one of said side surfaces, at least one of said second leadchannels being adapted to receive a second lead terminal; at least onesecond retention element, said at least one second retention elementpreventing said second lead terminal from moving substantially in asecond direction within said at least one second lead channel, saidsecond direction being different than said first direction.
 9. The basemember of claim 8, wherein said at least one first lead channel and saidat least one second lead channel are substantially parallel and orientedso as to extend from said top surface of said base body to said bottomsurface.
 10. The base member of claim 9, wherein said at least onesecond retention element comprises said at least one second lead channelhaving at least one variation in width along its length.
 11. The basemember of claim 10, wherein said at least one variation in width of saidat least one second lead channel comprises a first region and a secondregion, said first region having a width narrower than that of saidsecond region.
 12. The base member of claim 11, wherein said base bodycomprises a generally rectangular box-like form.
 13. The base member ofclaim 5, further comprising: a plurality of second lead channels, saidsecond lead channels being disposed substantially on at least one ofsaid side surfaces, at least one of said second lead channels beingadapted to receive a second lead terminal; at least one second retentionelement, said at least one second retention element preventing said leadterminal from moving substantially in a second direction within said atleast one second lead channel.
 14. The base member of claim 13, furthercomprising at least one through-hole disposed within said base member,said at least one through-hole forming a passage between said top andbottom surfaces and being adapted to receive at least one lead.
 15. Thebase member of claim 14, wherein said base member is chamfered on saidbottom surface in the region surrounding said at least one through-hole.16. An electronic device, comprising; a non-conducting three-dimensionalelectronic element base body having; top, side, and bottom surfaces; atleast one recess disposed at least partly within said base body; aplurality of lead channels extending from said top surface onto saidside surface of said base body; at least one first retention elementdisposed in each of a first subset of said plurality of lead channels;at least one electronic element disposed in said at least one recess,said electronic element having a plurality of wire leads, at least oneof said plurality of wire leads extending within at least one of saidplurality of lead channels; and a plurality of lead terminals receivedwithin respective ones of said plurality of lead channels, at least oneof said lead terminals forming a conductive contact with said at leastone of said plurality of wire leads; wherein the movement in alongitudinal direction of said lead terminals within said subset of saidplurality of lead channels is restricted by said first retentionelements.
 17. The electronic device of claim 16, wherein said firstretention elements comprise; a first shape formed within said firstsubset of lead channels along at least a portion of their length; asecond shape formed within the corresponding ones of said leadterminals, said second shape being substantially similar to said firstshape, the movement of said lead terminals within said first subset oflead channels thereby being restricted in a first direction.
 18. Theelectronic device of claim 17, said retention elements furthercomprising; a third shape formed within a second subset of saidplurality of lead channels along at least a portion of their length; afourth shape formed within the corresponding ones of said leadterminals, said fourth shape being substantially similar to said thirdshape, the movement of said lead terminals within said second subset oflead channels thereby being restricted in at least one second direction.19. The electronic device of claim 18, wherein; each of said pluralityof lead channels are parallel to one another; and said first directionis co-linear yet opposite said second direction, both of said first andsecond directions being oriented longitudinally within said plurality oflead channels.
 20. The interconnect device of claim 19, wherein saidbase body and said at least one electronic element are encapsulated in anon-conductive material.
 21. The interconnect device of claim 19,wherein said base body is formed from a high temperature liquid crystalpolymer.